3D Detector Activities: Difference between revisions
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== Our Activities == | == Our Activities == | ||
* TestBeam Analysis | * [[TestBeam Analysis]] | ||
* 3DSensor Characteristics | * 3DSensor Characteristics | ||
* 3DMeasurement System | * 3DMeasurement System | ||
Revision as of 13:30, 19 February 2009
Introduction to 3D detectors
3D detectors have three dimensional electrods going through the silicon substrate. The depletion thickness depends on p+ and n+ electrode distance. The advantages with 3D technology is:
- It can operate at very low voltages
- One can achieve very high radiation hardness
- Very fast
- Active almost to the edge
Schematic drawings of the 3D detector:
More information
- Testbeam talk by Erlend and Ole
- 3D workshop in Barcelona
- 3D-state of the art
- 3D proposal by S.I. Parker C.J. Kenneyand and J. Segal (NIMA395(1997)328)]
Our Activities
- TestBeam Analysis
- 3DSensor Characteristics
- 3DMeasurement System
Who are we?
- In Bergen: Bjarne, Heidi, Kristine, Ahmed ...
