ift - User contributions [en]

Reflow Soldering

2013-12-05T08:49:29Z

Tni071:

= Reflow Soldering =
This tutorial explains the use of the Techno Print HA-02 reflow oven. A simple and practical step-through procedure is suggested to limit the effort for the first time user. The user manual for the oven can be downloaded from [[Media:Rfo-ha02-manual.pdf]], while a quick search on the web for "reflow soldering" should give some basic knowledge about reflow soldering. The oven should be placed inside a fume cupboard to draw unhealthy and annoying solder fumes away from the person soldering.

== When to use it? ==
Do I really need this oven? Many components can easily be soldered by hand with better results. In general: if you can do it by hand, forget the oven. Some components do not have accessible pads, or they are simply too densely placed for hand soldering. This is when the oven comes in handy, although at the cost of some time and effort. Another example is when you repeat the same soldering process for several identical PCBs, as reflow soldering is a quite fast process once the time and temperature settings are known.

== Step 1 - Creating a Time and Temperature Profile ==
The process of soldering is divided into two zones - "preheat" and "reflow". Time and temperature has to be specified for both these zones to obtain the desired thermal profile, and the settings will differ from PCB to PCB. Temperature can be monitored by attaching a thermocouple to the PCB with Kapton tape. The desired thermal profile is then iteratively found by running the reflow process on the unpopulated PCB several times while adjusting the time and temperature settings of the oven.

[[File:Thermocouple.jpg|816px]]

Figure 1: Thermocouple used for temperature measurements

[[File:Recommended_solder_profile.png|816px]]

Figure 2: Recommended solder profile for Hamamatsu MPPC (From Hamamatsu S10362-11 series datasheet)

[[File:Meas_solder_profile.png|816px]]

Figure 3: Measured solder profile during reflow soldering

== Step 2 - Apply Solder Paste ==
When a reasonable thermal profile is found, the components are attached to the PCB by the use of solder paste. Solder paste can be applied from the dispenser by hand, and it is a good idea to try this a few times on an old PCB to get the right amount of paste. Avoid mixing different solder pastes, and remove any old solder tin from the PCB and the components before applying the paste. Then place the components.

== Step 3 - Do it! ==
You are now ready to do the actual reflow process. Since you now are familiar with the thermocouple, it might be a good idea to attach it to the PCB while doing the actual reflow soldering. In this way you can document that you actually followed the thermal profile when doing the real thing.

== Thermal Shielding ==
If you have a PCB that is already populated, you might want to thermally shield some or all components. This can be done by wrapping the PCB in aluminum foil with a window where you want to solder. Pay attention to the thermal profile in your window, since the foil will make it harder to heat the PCB.

[[File:Reflow_example.jpg|816px]]

Figure 4: Example of reflow soldering of MPPCs with thermal shielding and monitoring

[[Category:Mikroelektronikk]]
[[Category:Mikroelektronikk]]
[[Category:Mikroelektronikk]]

Reflow Soldering

2013-12-05T08:45:20Z

Tni071: added user manual pdf

= Reflow Soldering =
This tutorial explains the use of the Techno Print HA-02 reflow oven. A simple and practical step-through procedure is suggested to limit the effort for the first time user. The user manual for the oven can be downloaded from [File:Rfo-ha02-manual.pdf here], while a quick search on the web for "reflow soldering" should give some basic knowledge about reflow soldering. The oven should be placed inside a fume cupboard to draw unhealthy and annoying solder fumes away from the person soldering.

== When to use it? ==
Do I really need this oven? Many components can easily be soldered by hand with better results. In general: if you can do it by hand, forget the oven. Some components do not have accessible pads, or they are simply too densely placed for hand soldering. This is when the oven comes in handy, although at the cost of some time and effort. Another example is when you repeat the same soldering process for several identical PCBs, as reflow soldering is a quite fast process once the time and temperature settings are known.

== Step 1 - Creating a Time and Temperature Profile ==
The process of soldering is divided into two zones - "preheat" and "reflow". Time and temperature has to be specified for both these zones to obtain the desired thermal profile, and the settings will differ from PCB to PCB. Temperature can be monitored by attaching a thermocouple to the PCB with Kapton tape. The desired thermal profile is then iteratively found by running the reflow process on the unpopulated PCB several times while adjusting the time and temperature settings of the oven.

[[File:Thermocouple.jpg|816px]]

Figure 1: Thermocouple used for temperature measurements

[[File:Recommended_solder_profile.png|816px]]

Figure 2: Recommended solder profile for Hamamatsu MPPC (From Hamamatsu S10362-11 series datasheet)

[[File:Meas_solder_profile.png|816px]]

Figure 3: Measured solder profile during reflow soldering

== Step 2 - Apply Solder Paste ==
When a reasonable thermal profile is found, the components are attached to the PCB by the use of solder paste. Solder paste can be applied from the dispenser by hand, and it is a good idea to try this a few times on an old PCB to get the right amount of paste. Avoid mixing different solder pastes, and remove any old solder tin from the PCB and the components before applying the paste. Then place the components.

== Step 3 - Do it! ==
You are now ready to do the actual reflow process. Since you now are familiar with the thermocouple, it might be a good idea to attach it to the PCB while doing the actual reflow soldering. In this way you can document that you actually followed the thermal profile when doing the real thing.

== Thermal Shielding ==
If you have a PCB that is already populated, you might want to thermally shield some or all components. This can be done by wrapping the PCB in aluminum foil with a window where you want to solder. Pay attention to the thermal profile in your window, since the foil will make it harder to heat the PCB.

[[File:Reflow_example.jpg|816px]]

Figure 4: Example of reflow soldering of MPPCs with thermal shielding and monitoring

[[Category:Mikroelektronikk]]

[[Category:Mikroelektronikk]]
[[Category:Mikroelektronikk]]

File:Rfo-ha02-manual.pdf

2013-12-05T08:42:46Z

Tni071: Technoprint HA-02 reflow oven, user manual

Technoprint HA-02 reflow oven, user manual

Reflow Soldering

2013-12-05T08:41:33Z

Tni071:

= Reflow Soldering =
This tutorial explains the use of the Techno Print HA-02 reflow oven. A simple and practical step-through procedure is suggested to limit the effort for the first time user. The user manual for the oven can be downloaded from [http://www.technoprint-smt.nl/downloads/manuals/rfo-ha02-manual.pdf here], while a quick search on the web for ``reflow soldering'' should give some basic knowledge about reflow soldering. The oven should be placed inside a fume cupboard to draw unhealthy and annoying solder fumes away from the person soldering.

== When to use it? ==
Do I really need this oven? Many components can easily be soldered by hand with better results. In general: if you can do it by hand, forget the oven. Some components do not have accessible pads, or they are simply too densely placed for hand soldering. This is when the oven comes in handy, although at the cost of some time and effort. Another example is when you repeat the same soldering process for several identical PCBs, as reflow soldering is a quite fast process once the time and temperature settings are known.

== Step 1 - Creating a Time and Temperature Profile ==
The process of soldering is divided into two zones - ``preheat'' and ``reflow''. Time and temperature has to be specified for both these zones to obtain the desired thermal profile, and the settings will differ from PCB to PCB. Temperature can be monitored by attaching a thermocouple to the PCB with Kapton tape. The desired thermal profile is then iteratively found by running the reflow process on the unpopulated PCB several times while adjusting the time and temperature settings of the oven.

[[File:Thermocouple.jpg|816px]]

Figure 1: Thermocouple used for temperature measurements

[[File:Recommended_solder_profile.png|816px]]

Figure 2: Recommended solder profile for Hamamatsu MPPC (From Hamamatsu S10362-11 series datasheet)

[[File:Meas_solder_profile.png|816px]]

Figure 3: Measured solder profile during reflow soldering

== Step 2 - Apply Solder Paste ==
When a reasonable thermal profile is found, the components are attached to the PCB by the use of solder paste. Solder paste can be applied from the dispenser by hand, and it is a good idea to try this a few times on an old PCB to get the right amount of paste. Avoid mixing different solder pastes, and remove any old solder tin from the PCB and the components before applying the paste. Then place the components.

== Step 3 - Do it! ==
You are now ready to do the actual reflow process. Since you now are familiar with the thermocouple, it might be a good idea to attach it to the PCB while doing the actual reflow soldering. In this way you can document that you actually followed the thermal profile when doing the real thing.

== Thermal Shielding ==
If you have a PCB that is already populated, you might want to thermally shield some or all components. This can be done by wrapping the PCB in aluminum foil with a window where you want to solder. Pay attention to the thermal profile in your window, since the foil will make it harder to heat the PCB.

[[File:Reflow_example.jpg|816px]]

Figure 4: Example of reflow soldering of MPPCs with thermal shielding and monitoring

[[Category:Mikroelektronikk]]
[[Category:Mikroelektronikk]]

Reflow Soldering

2013-12-05T08:40:42Z

Tni071:

= Reflow Soldering =
This tutorial explains the use of the Techno Print HA-02 reflow oven. A simple and practical step-through procedure is suggested to limit the effort for the first time user. The user manual for the oven can be downloaded from [http://www.technoprint-smt.nl/downloads/manuals/rfo-ha02-manual.pdf here], while a quick search on the web for ``reflow soldering'' should give some basic knowledge about reflow soldering. The oven should be placed inside a fume cupboard to draw unhealthy and annoying solder fumes away from the person soldering.

== When to use it? ==
Do I really need this oven? Many components can easily be soldered by hand with better results. In general: if you can do it by hand, forget the oven. Some components do not have accessible pads, or they are simply too densely placed for hand soldering. This is when the oven comes in handy, although at the cost of some time and effort. Another example is when you repeat the same soldering process for several identical PCBs, as reflow soldering is a quite fast process once the time and temperature settings are known.

== Step 1 - Creating a Time and Temperature Profile ==
The process of soldering is divided into two zones - ``preheat'' and ``reflow''. Time and temperature has to be specified for both these zones to obtain the desired thermal profile, and the settings will differ from PCB to PCB. Temperature can be monitored by attaching a thermocouple to the PCB with Kapton tape. The desired thermal profile is then iteratively found by running the reflow process on the unpopulated PCB several times while adjusting the time and temperature settings of the oven.

[[File:Thermocouple.jpg|816px]]
Figure 1: Thermocouple used for temperature measurements

[[File:Recommended_solder_profile.png|816px]]
Figure 2: Recommended solder profile for Hamamatsu MPPC (From Hamamatsu S10362-11 series datasheet)

[[File:Meas_solder_profile.png|816px]]
Figure 3: Measured solder profile during reflow soldering

== Step 2 - Apply Solder Paste ==
When a reasonable thermal profile is found, the components are attached to the PCB by the use of solder paste. Solder paste can be applied from the dispenser by hand, and it is a good idea to try this a few times on an old PCB to get the right amount of paste. Avoid mixing different solder pastes, and remove any old solder tin from the PCB and the components before applying the paste. Then place the components.

== Step 3 - Do it! ==
You are now ready to do the actual reflow process. Since you now are familiar with the thermocouple, it might be a good idea to attach it to the PCB while doing the actual reflow soldering. In this way you can document that you actually followed the thermal profile when doing the real thing.

== Thermal Shielding ==
If you have a PCB that is already populated, you might want to thermally shield some or all components. This can be done by wrapping the PCB in aluminum foil with a window where you want to solder. Pay attention to the thermal profile in your window, since the foil will make it harder to heat the PCB.

[[File:Reflow_example.jpg|816px]]

Figure 4: Example of reflow soldering of MPPCs with thermal shielding and monitoring

[[Category:Mikroelektronikk]]
[[Category:Mikroelektronikk]]

Reflow Soldering

2013-12-05T08:39:30Z

Tni071: added some figures

= Reflow Soldering =
This tutorial explains the use of the Techno Print HA-02 reflow oven. A simple and practical step-through procedure is suggested to limit the effort for the first time user. The user manual for the oven can be downloaded from [http://www.technoprint-smt.nl/downloads/manuals/rfo-ha02-manual.pdf here], while a quick search on the web for ``reflow soldering'' should give some basic knowledge about reflow soldering. The oven should be placed inside a fume cupboard to draw unhealthy and annoying solder fumes away from the person soldering.

== When to use it? ==
Do I really need this oven? Many components can easily be soldered by hand with better results. In general: if you can do it by hand, forget the oven. Some components do not have accessible pads, or they are simply too densely placed for hand soldering. This is when the oven comes in handy, although at the cost of some time and effort. Another example is when you repeat the same soldering process for several identical PCBs, as reflow soldering is a quite fast process once the time and temperature settings are known.

== Step 1 - Creating a Time and Temperature Profile ==
The process of soldering is divided into two zones - ``preheat'' and ``reflow''. Time and temperature has to be specified for both these zones to obtain the desired thermal profile, and the settings will differ from PCB to PCB. Temperature can be monitored by attaching a thermocouple to the PCB with Kapton tape. The desired thermal profile is then iteratively found by running the reflow process on the unpopulated PCB several times while adjusting the time and temperature settings of the oven.

[[File:Thermocouple.jpg|816px]]
Figure 1: Thermocouple used for temperature measurements

[[File:Recommended_solder_profile.jpg|816px]]
Figure 2: Recommended solder profile for Hamamatsu MPPC (From Hamamatsu S10362-11 series datasheet)

[[File:Meas_solder_profile.jpg|816px]]
Figure 3: Measured solder profile during reflow soldering

== Step 2 - Apply Solder Paste ==
When a reasonable thermal profile is found, the components are attached to the PCB by the use of solder paste. Solder paste can be applied from the dispenser by hand, and it is a good idea to try this a few times on an old PCB to get the right amount of paste. Avoid mixing different solder pastes, and remove any old solder tin from the PCB and the components before applying the paste. Then place the components.

== Step 3 - Do it! ==
You are now ready to do the actual reflow process. Since you now are familiar with the thermocouple, it might be a good idea to attach it to the PCB while doing the actual reflow soldering. In this way you can document that you actually followed the thermal profile when doing the real thing.

== Thermal Shielding ==
If you have a PCB that is already populated, you might want to thermally shield some or all components. This can be done by wrapping the PCB in aluminum foil with a window where you want to solder. Pay attention to the thermal profile in your window, since the foil will make it harder to heat the PCB.

[[File:Reflow_example.jpg|816px]]

Figure 4: Example of reflow soldering of MPPCs with thermal shielding and monitoring

[[Category:Mikroelektronikk]]

[[Category:Mikroelektronikk]]

File:Meas solder profile.png

2013-12-05T08:36:33Z

Tni071: Tni071 uploaded a new version of "File:Meas solder profile.png"

File:Meas solder profile.png

2013-12-05T08:35:10Z

Tni071:

File:Recommended solder profile.png

2013-12-05T08:19:39Z

Tni071:

File:Thermocouple.jpg

2013-12-05T08:16:11Z

Tni071:

Reflow Soldering

2013-12-04T12:21:20Z

Tni071:

= Reflow Soldering =
This tutorial explains the use of the Techno Print HA-02 reflow oven. A simple and practical step-through procedure is suggested to limit the effort for the first time user. The user manual for the oven can be downloaded from [http://www.technoprint-smt.nl/downloads/manuals/rfo-ha02-manual.pdf here], while a quick search on the web for "reflow soldering" should give some basic knowledge about reflow soldering. The oven should be placed inside a fume cupboard to draw unhealthy and annoying solder fumes away from the person soldering.

== When to use it? ==
Do I really need this oven? Many components can easily be soldered by hand with better results. In general: if you can do it by hand, forget the oven. Some components do not have accessible pads, or they are simply too densely placed for hand soldering. This is when the oven comes in handy, although at the cost of some time and effort. Another example is when you repeat the same soldering process for several identical PCBs, as reflow soldering is a quite fast process once the time and temperature settings are known.

== Step 1 - Creating a Time and Temperature Profile ==
The process of soldering with this oven is divided into two zones - "preheat" and "reflow". Time and temperature has to be specified for both these zones to obtain the desired thermal profile, and the settings will differ from PCB to PCB. Temperature can be monitored by attaching a thermocouple to the PCB with Kapton tape. The desired thermal profile is then iteratively found by running the reflow process on the unpopulated PCB several times while adjusting the time and temperature settings of the oven.

== Step 2 - Apply Solder Paste ==
When a reasonable thermal profile is found, the components are attached to the PCB by the use of solder paste. Solder paste can be applied from the dispenser by hand, and it is a good idea to try this a few times on an old PCB to get the right amount of paste. Avoid mixing different solder pastes, and remove any old solder tin from the PCB and the components before applying the paste. Then place the components.

== Step 3 - Do It! ==
You are now ready to do the actual reflow process. Since you now are familiar with the thermocouple, it might be a good idea to attach it to the PCB while doing the actual reflow soldering. In this way you can document that you actually followed the thermal profile when doing the real thing.

== Thermal Shielding ==
If you have a PCB that is already populated, you might want to thermally shield some or all components. This can be done by wrapping the PCB in aluminum foil with a window where you want to solder. Pay attention to the thermal profile in your window, since the foil will make it harder to heat the PCB.

[[File:Reflow_example.jpg|816px]]

Figure 1: Example of reflow soldering of SiPMs with thermal shielding and monitoring

[[Category:Mikroelektronikk]]

Reflow Soldering

2013-12-04T12:17:37Z

Tni071: Created page with "= Reflow Soldering = This tutorial explains the use of the Techno Print HA-02 reflow oven. A simple and practical step-through procedure is suggested to limit the effort for t..."

= Reflow Soldering =
This tutorial explains the use of the Techno Print HA-02 reflow oven. A simple and practical step-through procedure is suggested to limit the effort for the first time user. The user manual for the oven can be downloaded from [http://www.technoprint-smt.nl/downloads/manuals/rfo-ha02-manual.pdf here], while a quick search on the web for ``reflow soldering'' should give some basic knowledge about reflow soldering. The oven should be placed inside a fume cupboard to draw unhealthy and annoying solder fumes away from the person soldering.

== When to use it? ==
Do I really need this oven? Many components can easily be soldered by hand with better results. In general: if you can do it by hand, forget the oven. Some components do not have accessible pads, or they are simply too densely placed for hand soldering. This is when the oven comes in handy, although at the cost of some time and effort. Another example is when you repeat the same soldering process for several identical PCBs, as reflow soldering is a quite fast process once the time and temperature settings are known.

== Step 1 - Creating a Time and Temperature Profile ==
The process of soldering is divided into two zones - ``preheat'' and ``reflow''. Time and temperature has to be specified for both these zones to obtain the desired thermal profile, and the settings will differ from PCB to PCB. Temperature can be monitored by attaching a thermocouple to the PCB with Kapton tape. The desired thermal profile is then iteratively found by running the reflow process on the unpopulated PCB several times while adjusting the time and temperature settings of the oven.

== Step 2 - Apply Solder Paste ==
When a reasonable thermal profile is found, the components are attached to the PCB by the use of solder paste. Solder paste can be applied from the dispenser by hand, and it is a good idea to try this a few times on an old PCB to get the right amount of paste. Avoid mixing different solder pastes, and remove any old solder tin from the PCB and the components before applying the paste. Then place the components.

== Step 3 - Do It! ==
You are now ready to do the actual reflow process. Since you now are familiar with the thermocouple, it might be a good idea to attach it to the PCB while doing the actual reflow soldering. In this way you can document that you actually followed the thermal profile when doing the real thing.

== Thermal Shielding ==
If you have a PCB that is already populated, you might want to thermally shield some or all components. This can be done by wrapping the PCB in aluminum foil with a window where you want to solder. Pay attention to the thermal profile in your window, since the foil will make it harder to heat the PCB.

[[File:Reflow_example.jpg|816px]]

Figure 1: Example of reflow soldering of MPPCs with thermal shielding and monitoring

[[Category:Mikroelektronikk]]

Microelectronics group

2013-12-04T12:16:55Z

Tni071:

== Mikroelektronikk ==

Dokumentasjon for Mentor Graphics IC-programvaren finnes i katalogen /prog/mentor/icflow_2008_1/2008.1_rhelx86linux/icflow_home/shared/pdfdocs eller ../htmldocs/ . Bruk

* [[IC studio]] Veiledning til IC-design ved hjelp av IC studio

* [[IC studio - SPICE/Symbol Tutorial]] Relate a SPICE file to a Symbol

* [[IC Station]] Tegne utlegg for integrerte kretser

* [[Expedition PCB]] Komme i gang med kretskortutlegg ved hjelp av Expedition PCB

* [[Modelsim/Questa]] Skrive og simulere VHDL-kode med Mentor Graphics ModelSim

* [[PCI-eksperiment]] Øving med HLT-RORC-prototypekort

* [[Cadence Virtuoso]]

* [[Xilinx]] Øving i bruk av Xilinx Project Studio

* [[FLTK GUI]] Graphical User Interface using FLTK

* [[Tutorials]] Tutorials from the web

* [[ADS]] Getting started with Agilent Advanced Design System

* [[XJTAG]] Boundary Scan with XJTAG

* [[XJDeveloper]] Innføring i XJDeveloper

* [[PHYS222]] Fagressurser for PHYS222 og PHYS223

* [[PHYS321]] Fagressurser for PHYS321

* [[Teknisk hjelp]] Teknisk hjelp for bruk av DAK-programvare

* [[BGA lodding]] bruk av Martin 09.6 XL BGA lodding maskin (intern)

* [[Reflow Soldering]] Use of Technoprint HA-02 reflow oven

* [[SmartFusion2]] Oppsett og design med SF2

* [[SmartFusion2- AMBA APB, Custom Peripheral]] Making a custom peripheral for the AMBA APB bus

[[Category:Mikroelektronikk]]

File:Reflow example.jpg

2013-12-04T12:13:09Z

Tni071:

Expedition PCB introduction

2013-08-20T13:36:07Z

Tni071: Should be "Pad Round 65, Hole Rnd 41", not "Pad Round 64, Hole Rnd 41"

This lab is designed to teach you the basic workflow for creating a simple printed circuit board using the Mentor Graphics Expedition PCB tools. You will be looking at editor environments and fundamental library concepts. You will learn how to create padstacks and cells. You will eventually assemble databases for creating parts.

===Schedule===
Lab 1 (4 hours)
* Introduction to Expedition PCB
* LIBRARY & DATA OVERVIEW (15 min)
* CREATING PADSTACKS : exercise (45 min)
* CREATING CELLS : exercise (45 min)
* CREATING SYMBOLS : exercise (15 min)
* CREATING PARTS : exercise (30 min)
* CREATING A CUSTOM LAYOUT TEMPLATE : exercise (15 min)

==Introduction to Expedition PCB==
Open the dashboard application /prog/mentor/ee2007.7/2007.7EE/SDD_HOME/common/linux/bin/dash & . The left panel (Shortcuts) is for placing shortcuts to applications. Drag the ExpeditionPCB, ePlanner, DxDesigner, and Library Manager icons to the Shortcuts area from the Toolboxes directories. Expedition PCB is the High-Speed (HS) layout tool. ePlanner is the tool for setting up the HS constraints. DxDesigner is the schematic capture tool, while the Library Manager allows you to create pad stacks, cells, symbols, and parts. Your projects will listed as they are created.

==PART 1 PADSTACK DEFINITION==
# Open the “Library Manager” and create a new library for example under directory $HOME/kurs/lab1. What you do is to create a new directory $HOME/kurs/lab1/ and the library manager will create a number of files and directories in there.
# Click on the “Setup” menu and select “Partition Editor”, or use the buttons under the menus. See that there are initially only 25 symbols declared and no cells, no PDBs and no IBIS models. Click on “cancel”.
#: You can always chose between menus and buttons.
# Under “Setup” select “Setup Parameters”. See that under “General” nothing is declared, but under “Via Definitions” there is only one standard padstack declared called “L: 026VIA”. Select “close”.
# Select the button “Library Services”. Select “Padstacks” menu and select with the browser for the “input from” to “/heim/kjetil/mgc/phys321.lmc”. Click on “open”.
# Select from “Padstacks in import partition” the “IPC, SOIC” and "Pad Round 65, Hole Rnd 41" padstacks. Be sure you select mode = “copy”. Press the “right arrow” and then “apply”. See that in the left table, the imported padstacks (for example the “IPC, SOIC”) will have a blue color. Select “close”.
# Select in the "Library Navigator Tree" the “Padstacks" item (folder). You should now have two padstack declarations under item "All". Examine the properties of both padstack declarations by double clicking on one of them.
# Examine the menus “Pads” and “Holes” from the “Padstack Editor”. Click in the menus once on the declared names listed and examine their declarations.

===Exercise===
Create a padstack definition for the through hole via with min. 250 μm and pad min. 450 μm (Hint: define first the “hole” and then the “pads” you need. Finally create the “padstack” with the newly declared “hole” and “pads” definitions.)

===Summary===
You now have learned how to create your own library; copy padstack definitions from other libraries and create your own padstacks with help of documents you get from the PCB manufacturer.

==PART 2 CREATING NEW CELLS==
You should have the “lab1” Library open in the Library Manager.

# Right-click on the "Cells" folder in the Library Navigator Tree.
# Create a new “Partition” called “amplifiers”.
# Right-click on the "amplifiers" section and select "New Cell".
# Enter the Cell name "8SO".
# Specify a Total number of pins of 8. Specify a Layers while editing cell of 4. Choose the IC – SOIC Package group.
# Click the "Cell Properties" button. Enter a description of SOIC 8. Set the Units to mm. Specify a Height of 1.75.
# On the Package Cell Properties dialogue, <click> the Close button.
# On the Create Package Cell dialogue, <click> the Next button and the Cell Editor tool should open.
# On the Place Pins dialogue, click the Pin # column until the pins are sorted from 1 to 8.
# Select the Padstack Name field for pin 1. Press and hold the <Shift> key then select the Padstack Name field for pin 8.
# Continuing to hold the Shift key, click the down arrow in the Padstack Name field for pin 8, and choose the SOIC padstack from the pulldown list. It should now be assigned to all of the pins.
# Click the Pattern Place tab.
# Set the Pattern type to SOIC and enter the following values into the pattern form:
#: Body length = 5
#: Body width = 3
#: Pin to pin spacing = 1.27
#: Row to row spacing = 5.2
#: Make sure the Include Assembly outline and Include Silkscreen outline option are checked.
# With the pins still selected, <click> the Place button.
# Click the Close button on the Place Pins dialogue.
# Examine the graphics. Select File>Save from the menus and then select File>Exit Graphics from the menus.
# Click the S80 symbol to examine the Preview of the new cell.
# Click the New Cell button.
# Enter the Cell name 8DIP.
# Set the Total number of pins to 8. Set the Layers while editing cell to 4. Choose the IC - DIP Package group.
# Click the Cell Properties button. Enter a description of DIP 8. Verify that the Units is set to th.(=mil) Specify a Height of 100. Click the Close button.
# On the Create Package Cell dialog, click the Next button.
# Move the Place Pins dialog out of the way.
# In the graphics environment, select Setup > Editor Control from the menus.
# Select the Grids tab. Specify a Route grid of 25 and a Drawing grid of 25.
# On the Place Pins dialogue, select the Padstack Name field for pin 1. Press and hold the <Shift> key then select the Padstack Name field for pin 8.
# Continuing to hold the <Shift> key, <click> the down arrow in the Padstack Name field for pin 8 and choose the through via Pad Round 65, Hole Rond 41 (the one from previous exercise) from the pulldown list. It should then be assigned to all of the pins.
# Click the Parameter Place tab and enter the following values:
#: Columns: 4 Spacing: 100
#: Rows: 2 Spacing: 300
#: Pin Sequence = first option.
# Click the Place button.
# Position the cursor over the drawing area. The pins are attached to the cursor for placement. Click directly on the “origin” marker to place them down.
# Select View>Fit All from the menus.
# Select Edit>Place>Assembly Outline from the menus. Using the Rectangle draw tool, draw a rectangle inside of all the pins. Draw any other assembly graphics you desire by selecting another draw tool.
# Select Edit>Place>Silkscreen Outline from the menus. Draw a rectangle outside of all the pins. Draw any other silkscreen graphics you desire.
# Select Edit>Place>Placement Outline. Draw a rectangle a little larger than the silkscreen outline.
# Move Reference Designator and Part Number text as desired by first selecting the text, positioning the mouse cursor over the text border until a “move” cursor appears, then click-drag the text.
# Select Edit>Place>Silkscreen Ref Des from the menus and place the text outside of the silkscreen outline.
# Select File>Save from the menus.
# Select File>Exit Graphics from the menus.
# Select each cell in the list to see a Preview of it.

==PART 3 CREATING SYMBOLS==
You should have the “lab1” Central Library open in the Library Manager.

# Right-click on the "Symbols" folder in the Library Navigator Tree.
# Create a new “Partition” called “amplifiers”.
# Right-click on the "amplifiers" folder under the "Symbols" folder in the Library Navigator Tree.
# Create a new “Symbol” called “amp215”. (A graphical editor should pop-up.)
# Examine the window and create the opamp as pictured below: (don’t forget to give the pins properties e.g. “input” property or “output” property.)
# Save your work and exit the “Symbol Editor”. During “saving”, the design is checked against DRC rules.

[[Image:amp215_symbol.png|centre|Symbol to draw for the OpAmp]]

==PART 4 CREATING PARTS==
You should have the “lab1” Central Library open in the Library Manager.

# Right-click on the "Parts" folder in the Library Navigator Tree.
# Create a new “Partition” called “amplifiers”.
# Right-click on the "amplifiers" folder under the "Parts" folder in the Library Navigator Tree.
# Create a new “Part” called “amp01”. (The Part Editor dialogue should pop-up.)
# Change the Number to "Opamp1". Change the Label to "amp01A".
# At the lower-left corner of the PartsDB Editor dialog, verify that the Component property value for Type is IC.
# Enter the Description of IC, "A single amplifier packaged".
# Specify a Reference des prefix of "U".
# On the Part Editor dialog, click the Pin Mapping button.
# In the Assign symbols section of the dialog (upper-left corner), click the Import button.
# On the Import dialog, select the symbol name amp215 from the list (select "amplifiers" from the Central Library, and then the Symbol name).
# Select Create New gate information option.
# Enter the Number of slots as 1.
# Select the Include pin properties option.
# Click the OK button. A new gate will be created in the Logical table with 4 slots.
# In the Assign package cell section of the dialog (upper-right corner), click on the Import button.
# On the Import dialog, select 8DIP from the list of cells and <click> the OK button.
# Examine the Logical table and Physical table at the bottom of the Pin Mapping dialog. The symbol imported with 1 slot defined.
# Click the Physical tab. Enter the following physical pin outs:
#: In1 2
#: In2 3
#: VCC 6
#: GND 7
#: Out 8
# Click the Supply and NC tab.
# Enter a Pin # of 1,4,5 for NC.
# Click the OK button on the Pin Mapping dialog to save your work.
# Select File>Save from the menus.
# Exit the Part Editor.

[[Image:amp1_pin_mapping.png|centre|Pin mapping dialogue the OpAmp]]

==PART 5 CREATING A LAYOUT TEMPLATE==
You should have the “lab1” Central Library open in the Library Manager.

# Click button “layout templates”.
# Click once on the “4 layer Template” and press the “copy template” button above.
# Click once on the copied template and give it the name “lab1 template”.
# Click once on the “edit template” button. A default template is opened in “Expedition PCB”.
# Click on the menu “Setup>Setup Parameters”.
# In the “General” tap set the “number of physical layers” to 6. “Display units” should be set to “microns” and “meters/s”. Click on “Apply”.
# In the “Layer Stackup” tab change for all dielectric layers thickness the value to “500 um”. Make sure you select the option “keep layer stackup in sync with layer def. In Planes tab.”
# Select “OK”.
# “Save” the template and “exit”.

[[Category:Mikroelektronikk]]

Expedition PCB introduction

2013-08-20T13:35:16Z

Tni071: Reverted edits by Tni071 (talk) to last revision by Nfyku

This lab is designed to teach you the basic workflow for creating a simple printed circuit board using the Mentor Graphics Expedition PCB tools. You will be looking at editor environments and fundamental library concepts. You will learn how to create padstacks and cells. You will eventually assemble databases for creating parts.

===Schedule===
Lab 1 (4 hours)
* Introduction to Expedition PCB
* LIBRARY & DATA OVERVIEW (15 min)
* CREATING PADSTACKS : exercise (45 min)
* CREATING CELLS : exercise (45 min)
* CREATING SYMBOLS : exercise (15 min)
* CREATING PARTS : exercise (30 min)
* CREATING A CUSTOM LAYOUT TEMPLATE : exercise (15 min)

==Introduction to Expedition PCB==
Open the dashboard application /prog/mentor/ee2007.7/2007.7EE/SDD_HOME/common/linux/bin/dash & . The left panel (Shortcuts) is for placing shortcuts to applications. Drag the ExpeditionPCB, ePlanner, DxDesigner, and Library Manager icons to the Shortcuts area from the Toolboxes directories. Expedition PCB is the High-Speed (HS) layout tool. ePlanner is the tool for setting up the HS constraints. DxDesigner is the schematic capture tool, while the Library Manager allows you to create pad stacks, cells, symbols, and parts. Your projects will listed as they are created.

==PART 1 PADSTACK DEFINITION==
# Open the “Library Manager” and create a new library for example under directory $HOME/kurs/lab1. What you do is to create a new directory $HOME/kurs/lab1/ and the library manager will create a number of files and directories in there.
# Click on the “Setup” menu and select “Partition Editor”, or use the buttons under the menus. See that there are initially only 25 symbols declared and no cells, no PDBs and no IBIS models. Click on “cancel”.
#: You can always chose between menus and buttons.
# Under “Setup” select “Setup Parameters”. See that under “General” nothing is declared, but under “Via Definitions” there is only one standard padstack declared called “L: 026VIA”. Select “close”.
# Select the button “Library Services”. Select “Padstacks” menu and select with the browser for the “input from” to “/heim/kjetil/mgc/phys321.lmc”. Click on “open”.
# Select from “Padstacks in import partition” the “IPC, SOIC” and "Pad Round 64, Hole Rnd 41" padstacks. Be sure you select mode = “copy”. Press the “right arrow” and then “apply”. See that in the left table, the imported padstacks (for example the “IPC, SOIC”) will have a blue color. Select “close”.
# Select in the "Library Navigator Tree" the “Padstacks" item (folder). You should now have two padstack declarations under item "All". Examine the properties of both padstack declarations by double clicking on one of them.
# Examine the menus “Pads” and “Holes” from the “Padstack Editor”. Click in the menus once on the declared names listed and examine their declarations.

===Exercise===
Create a padstack definition for the through hole via with min. 250 μm and pad min. 450 μm (Hint: define first the “hole” and then the “pads” you need. Finally create the “padstack” with the newly declared “hole” and “pads” definitions.)

===Summary===
You now have learned how to create your own library; copy padstack definitions from other libraries and create your own padstacks with help of documents you get from the PCB manufacturer.

==PART 2 CREATING NEW CELLS==
You should have the “lab1” Library open in the Library Manager.

# Right-click on the "Cells" folder in the Library Navigator Tree.
# Create a new “Partition” called “amplifiers”.
# Right-click on the "amplifiers" section and select "New Cell".
# Enter the Cell name "8SO".
# Specify a Total number of pins of 8. Specify a Layers while editing cell of 4. Choose the IC – SOIC Package group.
# Click the "Cell Properties" button. Enter a description of SOIC 8. Set the Units to mm. Specify a Height of 1.75.
# On the Package Cell Properties dialogue, <click> the Close button.
# On the Create Package Cell dialogue, <click> the Next button and the Cell Editor tool should open.
# On the Place Pins dialogue, click the Pin # column until the pins are sorted from 1 to 8.
# Select the Padstack Name field for pin 1. Press and hold the <Shift> key then select the Padstack Name field for pin 8.
# Continuing to hold the Shift key, click the down arrow in the Padstack Name field for pin 8, and choose the SOIC padstack from the pulldown list. It should now be assigned to all of the pins.
# Click the Pattern Place tab.
# Set the Pattern type to SOIC and enter the following values into the pattern form:
#: Body length = 5
#: Body width = 3
#: Pin to pin spacing = 1.27
#: Row to row spacing = 5.2
#: Make sure the Include Assembly outline and Include Silkscreen outline option are checked.
# With the pins still selected, <click> the Place button.
# Click the Close button on the Place Pins dialogue.
# Examine the graphics. Select File>Save from the menus and then select File>Exit Graphics from the menus.
# Click the S80 symbol to examine the Preview of the new cell.
# Click the New Cell button.
# Enter the Cell name 8DIP.
# Set the Total number of pins to 8. Set the Layers while editing cell to 4. Choose the IC - DIP Package group.
# Click the Cell Properties button. Enter a description of DIP 8. Verify that the Units is set to th.(=mil) Specify a Height of 100. Click the Close button.
# On the Create Package Cell dialog, click the Next button.
# Move the Place Pins dialog out of the way.
# In the graphics environment, select Setup > Editor Control from the menus.
# Select the Grids tab. Specify a Route grid of 25 and a Drawing grid of 25.
# On the Place Pins dialogue, select the Padstack Name field for pin 1. Press and hold the <Shift> key then select the Padstack Name field for pin 8.
# Continuing to hold the <Shift> key, <click> the down arrow in the Padstack Name field for pin 8 and choose the through via Pad Round 65, Hole Rond 41 (the one from previous exercise) from the pulldown list. It should then be assigned to all of the pins.
# Click the Parameter Place tab and enter the following values:
#: Columns: 4 Spacing: 100
#: Rows: 2 Spacing: 300
#: Pin Sequence = first option.
# Click the Place button.
# Position the cursor over the drawing area. The pins are attached to the cursor for placement. Click directly on the “origin” marker to place them down.
# Select View>Fit All from the menus.
# Select Edit>Place>Assembly Outline from the menus. Using the Rectangle draw tool, draw a rectangle inside of all the pins. Draw any other assembly graphics you desire by selecting another draw tool.
# Select Edit>Place>Silkscreen Outline from the menus. Draw a rectangle outside of all the pins. Draw any other silkscreen graphics you desire.
# Select Edit>Place>Placement Outline. Draw a rectangle a little larger than the silkscreen outline.
# Move Reference Designator and Part Number text as desired by first selecting the text, positioning the mouse cursor over the text border until a “move” cursor appears, then click-drag the text.
# Select Edit>Place>Silkscreen Ref Des from the menus and place the text outside of the silkscreen outline.
# Select File>Save from the menus.
# Select File>Exit Graphics from the menus.
# Select each cell in the list to see a Preview of it.

==PART 3 CREATING SYMBOLS==
You should have the “lab1” Central Library open in the Library Manager.

# Right-click on the "Symbols" folder in the Library Navigator Tree.
# Create a new “Partition” called “amplifiers”.
# Right-click on the "amplifiers" folder under the "Symbols" folder in the Library Navigator Tree.
# Create a new “Symbol” called “amp215”. (A graphical editor should pop-up.)
# Examine the window and create the opamp as pictured below: (don’t forget to give the pins properties e.g. “input” property or “output” property.)
# Save your work and exit the “Symbol Editor”. During “saving”, the design is checked against DRC rules.

[[Image:amp215_symbol.png|centre|Symbol to draw for the OpAmp]]

==PART 4 CREATING PARTS==
You should have the “lab1” Central Library open in the Library Manager.

# Right-click on the "Parts" folder in the Library Navigator Tree.
# Create a new “Partition” called “amplifiers”.
# Right-click on the "amplifiers" folder under the "Parts" folder in the Library Navigator Tree.
# Create a new “Part” called “amp01”. (The Part Editor dialogue should pop-up.)
# Change the Number to "Opamp1". Change the Label to "amp01A".
# At the lower-left corner of the PartsDB Editor dialog, verify that the Component property value for Type is IC.
# Enter the Description of IC, "A single amplifier packaged".
# Specify a Reference des prefix of "U".
# On the Part Editor dialog, click the Pin Mapping button.
# In the Assign symbols section of the dialog (upper-left corner), click the Import button.
# On the Import dialog, select the symbol name amp215 from the list (select "amplifiers" from the Central Library, and then the Symbol name).
# Select Create New gate information option.
# Enter the Number of slots as 1.
# Select the Include pin properties option.
# Click the OK button. A new gate will be created in the Logical table with 4 slots.
# In the Assign package cell section of the dialog (upper-right corner), click on the Import button.
# On the Import dialog, select 8DIP from the list of cells and <click> the OK button.
# Examine the Logical table and Physical table at the bottom of the Pin Mapping dialog. The symbol imported with 1 slot defined.
# Click the Physical tab. Enter the following physical pin outs:
#: In1 2
#: In2 3
#: VCC 6
#: GND 7
#: Out 8
# Click the Supply and NC tab.
# Enter a Pin # of 1,4,5 for NC.
# Click the OK button on the Pin Mapping dialog to save your work.
# Select File>Save from the menus.
# Exit the Part Editor.

[[Image:amp1_pin_mapping.png|centre|Pin mapping dialogue the OpAmp]]

==PART 5 CREATING A LAYOUT TEMPLATE==
You should have the “lab1” Central Library open in the Library Manager.

# Click button “layout templates”.
# Click once on the “4 layer Template” and press the “copy template” button above.
# Click once on the copied template and give it the name “lab1 template”.
# Click once on the “edit template” button. A default template is opened in “Expedition PCB”.
# Click on the menu “Setup>Setup Parameters”.
# In the “General” tap set the “number of physical layers” to 6. “Display units” should be set to “microns” and “meters/s”. Click on “Apply”.
# In the “Layer Stackup” tab change for all dielectric layers thickness the value to “500 um”. Make sure you select the option “keep layer stackup in sync with layer def. In Planes tab.”
# Select “OK”.
# “Save” the template and “exit”.

[[Category:Mikroelektronikk]]

Expedition PCB introduction

2013-08-20T13:34:31Z

Tni071: Should be "Pad Round 65, Hole Rnd 41", not "Pad Round 65, Hole Rnd 41".

IC studio - SPICE/Symbol Tutorial

2013-02-15T11:52:49Z

Tni071: SPICE Symbol tutorial added

= Include a SPICE File in IC Studio =
This is a description of how to download a spice file from the web and include it in your IC studio project. A symbol is created to represent the component described by the spice file, and the procedure of linking the spice file to your symbol is described (See the [[IC studio]] tutorial if you are new to symbols). The AD8000 opamp is used as an example throughout this tutorial.

==Download a SPICE File==
Search the internet for a spice model, i.e. "AD8000 spice model". The vendor will normally provide such a file which can be downloaded. Open the file (ad8000p.cir) in a text editor and scroll down to the node assignments. The node assignments should match (identically) the pins of your soon to be created symbol.

* Node assignments
* non-inverting input
* | inverting input
* | | positive supply
* | | | negative supply
* | | | | output
* | | | | | Power down
* | | | | | |
.SUBCKT AD8000 1 2 Vcc Vee Vout PD

==Create a Symbol==
First you have to create a project library as explained in [[IC studio]]. In the cell view you should create a cell for your component which is of the view type "symbol". The next step is to start drawing your symbol with the desired shape and pins:

Use the palette on the left side of the screen to draw lines, or use a predefined shape (i.e. a rectangle). From the same palette you can choose the "Add Pin" button. Choose the pin preferences as you find suitable, but note that the pin names must be identical to the node assignments in the spice file. Place your pins and create a nice symbol...

==Relate a SPICE File to a Symbol==
Now you have a symbol, but it does not have any relation to the spice file except from the pin names. Right click on the cell you just made and add a new view of the type "spice". An almost blank spice file will pop up in the IC Studio text editor. Delete what is there and go to "file->insert file" and choose the spice file you have downloaded (you can also copy-paste the spice file) - save it.

When you close the text editor, you will get a message: "Spice File Changed - Do you want to change the top sub-circuit"? Press yes and select the desired sub-circuit name. The following message should appear in IC Studio:

// Starting Spice registration ... please wait
// Note: Registering SPICE model "AD8000" with symbol "ad8000"
// Note: Registration succeeded

Create a new cell with your top-level circuit ("schematic" view). Now you can include the component by "Right-click -> Instance -> Choose Symbol -> Your symbol" and draw your circuit around it.

That's it!

==Doesn't Work?==
*Did you "Create Viewpoint" as described in [[IC studio]]?
*Did you "Set Simulation Models" as described in [[IC studio]]?
*Did you choose an "Analysis" (i.e. "Transient" or "DC") to be performed in simulation mode?
*Do the node assignments correspond to the pin names on your symbol?
*Some spice models you find on the web are written for PSPICE, HSPICE or some other SPICE language that might have syntax which is not supported by ELDO. Try to comment these out within the SPICE file, or replace with supported syntax (see ELDO User's Manual).

[[Category:Mikroelektronikk]]

Microelectronics group

2013-02-15T11:50:07Z

Tni071:

IC studio - SPICE Symbol

2013-02-15T11:46:59Z

Tni071:

IC studio - SPICE Symbol

2013-02-15T10:54:53Z

Tni071: SPICE Symbol tutorial added

= Include a SPICE File in IC Studio =
This is a description of how to download a spice file from the web and include it in your IC studio project. A symbol is created to represent the component described by the spice file, and the procedure of linking the spice file to your symbol is described (See the [[IC studio]] tutorial if you are new to symbols). The AD8000 opamp is used as an example throughout this tutorial.

==Download a SPICE File==
Search the internet for a spice model, i.e. ``AD8000 spice model''. The vendor will normally provide such a file which can be downloaded. Open the file (ad8000p.cir) in a text editor and scroll down to the node assignments. The node assignments should match (identically) the pins of your soon to be created symbol.

* Node assignments
* non-inverting input
* | inverting input
* | | positive supply
* | | | negative supply
* | | | | output
* | | | | | Power down
* | | | | | |
.SUBCKT AD8000 1 2 Vcc Vee Vout PD

==Create a Symbol==
First you have to create a project library as explained in [[IC studio]]. In the cell view you should create a cell for your component which is of the view type ``symbol''. The next step is to start drawing your symbol with the desired shape and pins:

Use the palette on the left side of the screen to draw lines, or use a predefined shape (i.e. a rectangle). From the same palette you can choose the ``Add Pin'' button. Choose the pin preferences as you find suitable, but note that the pin names must be identical to the node assignments in the spice file. Place your pins and create a nice symbol...

==Relate a SPICE File to a Symbol==
Now you have a symbol, but it does not have any relation to the spice file except from the pin names. Right click on the cell you just made and add a new view of the type ``spice''. An almost blank spice file will pop up in the IC Studio text editor. Delete what is there and go to ``file->insert file`` and choose the spice file you have downloaded (you can also copy-paste the spice file) - save it.

When you close the text editor, you will get a message: ''Spice File Changed - Do you want to change the top sub-circuit``? Press yes and select the desired sub-circuit name. The following message should appear in IC Studio:

// Starting Spice registration ... please wait
// Note: Registering SPICE model "AD8000" with symbol "ad8000"
// Note: Registration succeeded

Create a new cell with your top-level circuit (''schematic`` view). Now you can include the component by ''Right-click -> Instance -> Choose Symbol -> Your symbol`` and draw your circuit around it.

That's it!

==Doesn't Work?==
*Did you ''Create Viewpoint`` as described in [[IC studio]]?
*Did you ''Set Simulation Models`` as described in [[IC studio]]?
*Did you choose an "Analysis" (i.e. "Transient" or "DC") to be performed in simulation mode?
*Do the node assignments correspond to the pin names on your symbol?
*Some spice models you find on the web are written for PSPICE, HSPICE or some other SPICE language that might have syntax which is not supported by ELDO. Try to comment these out within the SPICE file, or replace them with similar syntax (see ELDO User's Manual).

[[Category:Mikroelektronikk]]

Microelectronics group

2013-02-15T10:52:20Z

Tni071:

== Mikroelektronikk ==

Dokumentasjon for Mentor Graphics IC-programvaren finnes i katalogen /prog/mentor/icflow_2008_1/2008.1_rhelx86linux/icflow_home/shared/pdfdocs eller ../htmldocs/ . Bruk

* [[IC studio]] Veiledning til IC-design ved hjelp av IC studio

* [[IC studio - SPICE Symbol]] Create a component symbol using a SPICE file

* [[IC Station]] Tegne utlegg for integrerte kretser

* [[Expedition PCB]] Komme i gang med kretskortutlegg ved hjelp av Expedition PCB

* [[Modelsim/Questa]] Skrive og simulere VHDL-kode med Mentor Graphics ModelSim

* [[PCI-eksperiment]] Øving med HLT-RORC-prototypekort

* [[Cadence Virtuoso]]

* [[Xilinx]] Øving i bruk av Xilinx Project Studio

* [[FLTK GUI]] Graphical User Interface using FLTK

* [[Tutorials]] Tutorials from the web

* [[ADS]] Getting started with Agilent Advanced Design System

* [[XJTAG]] Boundary Scan with XJTAG

* [[XJDeveloper]] Innføring i XJDeveloper

* [[PHYS222]] Fagressurser for PHYS222 og PHYS223

* [[PHYS321]] Fagressurser for PHYS321

* [[Teknisk hjelp]] Teknisk hjelp for bruk av DAK-programvare

* [[BGA lodding]] bruk av Martin 09.6 XL BGA lodding maskin (intern)

[[Category:Mikroelektronikk]]

Microelectronics group

2013-02-15T10:51:30Z

Tni071:

== Mikroelektronikk ==

Dokumentasjon for Mentor Graphics IC-programvaren finnes i katalogen /prog/mentor/icflow_2008_1/2008.1_rhelx86linux/icflow_home/shared/pdfdocs eller ../htmldocs/ . Bruk

* [[IC studio]] Veiledning til IC-design ved hjelp av IC studio

* [[IC studio]] Create a component symbol using a SPICE file

* [[IC Station]] Tegne utlegg for integrerte kretser

* [[Expedition PCB]] Komme i gang med kretskortutlegg ved hjelp av Expedition PCB

* [[Modelsim/Questa]] Skrive og simulere VHDL-kode med Mentor Graphics ModelSim

* [[PCI-eksperiment]] Øving med HLT-RORC-prototypekort

* [[Cadence Virtuoso]]

* [[Xilinx]] Øving i bruk av Xilinx Project Studio

* [[FLTK GUI]] Graphical User Interface using FLTK

* [[Tutorials]] Tutorials from the web

* [[ADS]] Getting started with Agilent Advanced Design System

* [[XJTAG]] Boundary Scan with XJTAG

* [[XJDeveloper]] Innføring i XJDeveloper

* [[PHYS222]] Fagressurser for PHYS222 og PHYS223

* [[PHYS321]] Fagressurser for PHYS321

* [[Teknisk hjelp]] Teknisk hjelp for bruk av DAK-programvare

* [[BGA lodding]] bruk av Martin 09.6 XL BGA lodding maskin (intern)

[[Category:Mikroelektronikk]]